RAMMon v1.0 Build: 1015 built with SysInfo v1.0 Build: 1097
PassMark (R) Software - www.passmark.com

Memory Summary For GAME
Number of Memory Devices: 1	Total Physical Memory: 8134 MB (8192 MB)
				Total Available Physical Memory: 5023 MB
				Memory Load: 38%
ItemSlot #1Slot #2Slot #3Slot #4
Ram Type DDR3 Not Populated Not Populated Not Populated
Maximum Clock Speed (MHz) 800 (JEDEC)
Maximum Transfer Speed (MHz) DDR3-1600
Maximum Bandwidth (MB/s) PC3-12800
Memory Capacity (MB) 8192
Jedec Manufacture Name Golden Empire
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SPD Revision 1.1
Registered No
ECC No
DIMM Slot # 1
Manufactured Week 40 of Year 2012
Module Part # CL10-10-10 D3-1600
Module Revision 0x0
Module Serial # 0x0
Module Manufacturing Location 0
# of Row Addressing Bits 16
# of Column Addressing Bits 10
# of Banks 8
# of Ranks 2
Device Width in Bits 8
Bus Width in Bits 64
Module Voltage 1.5V
CAS Latencies Supported 5 6 8 10 11
Timings @ Max Frequency (JEDEC) 11-11-11-28
Maximum frequency (MHz) 800
Maximum Transfer Speed (MHz) DDR3-1600
Maximum Bandwidth (MB/s) PC3-12800
Minimum Clock Cycle Time, tCK (ns) 1.250
Minimum CAS Latency Time, tAA (ns) 13.750
Minimum RAS to CAS Delay, tRCD (ns) 13.750
Minimum Row Precharge Time, tRP (ns) 13.750
Minimum Active to Precharge Time, tRAS (ns) 35.000
Minimum Row Active to Row Active Delay, tRRD (ns) 6.000
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) 48.750
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) 300.000
DDR3 Specific SPD Attributes
Write Recovery Time, tWR (ns) 15.000
Internal Write to Read Command Delay, tWTR (ns) 7.500
Internal Read to Precharge Command Delay, tRTP (ns) 7.500
Minimum Four Activate Window Delay, tFAW (ns) 30.000
RZQ / 6 Supported Yes
RZQ / 7 Supported Yes
DLL-Off Mode Supported Yes
Maximum Operating Temperature Range (C) 0-95
Refresh Rate at Extended Operating Temperature Range 2X
Auto-self Refresh Supported Yes
On-die Thermal Sensor Readout Supported No
Partial Array Self Refresh Supported No
Thermal Sensor Present No
Non-standard SDRAM Type 00
Module Type UDIMM
Module Height (mm) 30
Module Thickness (front), (mm) 2
Module Thickness (back), (mm) 2
Module Width (mm) 133.5
Reference Raw Card Used Raw Card B Rev. 1
DRAM Manufacture
XMP Attributes
XMP Revision 1.2
Enthusiast / Certified Profile
Module voltage 1.50V
Clock speed (MHz) 800
Transfer Speed (MHz) DDR3-1600
Bandwidth (MB/s) PC3-12800
Minimum clock cycle time, tCK (ns) 1.250
Supported CAS latencies 10
Minimum CAS latency time, tAA (ns) 12.500
Minimum RAS to CAS delay time, tRCD (ns) 12.500
Minimum row precharge time, tRP (ns) 12.500
Minimum active to precharge time, tRAS (ns) 35.000
Supported timing at highest clock speed 10-10-10-28
Minimum Row Active to Row Active Delay, tRRD (ns) 5.500
Minimum Active to Auto-Refresh Delay, tRC (ns) 41.250
Minimum Recovery Delay, tRFC (ns) 300.000
Minimum Write Recovery time, tWR (ns) 15.000
Minimum Write to Read CMD Delay, tWTR (ns) 7.500
Minimum Read to Pre-charge CMD Delay, tRTP (ns) 7.500
Minimum Four Activate Window Delay, tFAW (ns) 30.000
Maximum Average Periodic Refresh Interval, tREFI (us) 7.875
Write to Read CMD Turn-around Time Optimizations No adjustment
Read to Write CMD Turn-around Time Optimizations No adjustment
Back 2 Back CMD Turn-around Time Optimizations No adjustment
System CMD Rate Mode 2T