Item | Module #1 | Module #2 | Module #3 | Module #4 |
Ram Type |
DDR3 |
DDR3 |
DDR3 |
DDR3 |
Maximum Clock Speed (MHz) |
800 (XMP) |
800 (JEDEC) |
800 (XMP) |
800 (JEDEC) |
Maximum Transfer Speed (MHz) |
DDR3-1600 |
DDR3-1600 |
DDR3-1600 |
DDR3-1600 |
Maximum Bandwidth (MB/s) |
PC3-12800 |
PC3-12800 |
PC3-12800 |
PC3-12800 |
Memory Capacity (MB) |
4096 |
4096 |
4096 |
4096 |
Jedec Manufacture Name |
A-DATA Technology |
Hynix Semiconductor (Hyundai Electronics) |
A-DATA Technology |
Hynix Semiconductor (Hyundai Electronics) |
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SPD Revision |
1.0 |
1.2 |
1.0 |
1.2 |
Registered |
No |
No |
No |
No |
ECC |
No |
No |
No |
No |
DIMM Slot # |
1 |
2 |
3 |
4 |
Manufactured |
Week 37 of Year 2011 |
Week 16 of Year 2013 |
Week 37 of Year 2011 |
Week 16 of Year 2013 |
Module Part # |
DDR3L 1600G |
HMT451S6AFR8A-PB |
DDR3L 1600G |
HMT451S6AFR8A-PB |
Module Revision |
0x0 |
0x4E30 |
0x0 |
0x4E30 |
Module Serial # |
0x76D7 |
0x9589604 |
0x760D |
0x9789606 |
Module Manufacturing Location |
0 |
1 |
0 |
1 |
# of Row Addressing Bits |
15 |
16 |
15 |
16 |
# of Column Addressing Bits |
10 |
10 |
10 |
10 |
# of Banks |
8 |
8 |
8 |
8 |
# of Ranks |
2 |
1 |
2 |
1 |
Device Width in Bits |
8 |
8 |
8 |
8 |
Bus Width in Bits |
64 |
64 |
64 |
64 |
Module Voltage |
1.5V |
1.5V, 1.35V |
1.5V |
1.5V, 1.35V |
CAS Latencies Supported |
6 7 8 9 |
5 6 7 8 9 10 11 |
6 7 8 9 |
5 6 7 8 9 10 11 |
Timings @ Max Frequency (JEDEC) |
9-9-9-24 |
11-11-11-28 |
9-9-9-24 |
11-11-11-28 |
Maximum frequency (MHz) |
667 |
800 |
667 |
800 |
Maximum Transfer Speed (MHz) |
DDR3-1333 |
DDR3-1600 |
DDR3-1333 |
DDR3-1600 |
Maximum Bandwidth (MB/s) |
PC3-10600 |
PC3-12800 |
PC3-10600 |
PC3-12800 |
Minimum Clock Cycle Time, tCK (ns) |
1.500 |
1.250 |
1.500 |
1.250 |
Minimum CAS Latency Time, tAA (ns) |
13.125 |
13.125 |
13.125 |
13.125 |
Minimum RAS to CAS Delay, tRCD (ns) |
13.125 |
13.125 |
13.125 |
13.125 |
Minimum Row Precharge Time, tRP (ns) |
13.125 |
13.125 |
13.125 |
13.125 |
Minimum Active to Precharge Time, tRAS (ns) |
36.000 |
35.000 |
36.000 |
35.000 |
Minimum Row Active to Row Active Delay, tRRD (ns) |
6.000 |
6.000 |
6.000 |
6.000 |
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) |
49.125 |
48.125 |
49.125 |
48.125 |
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) |
160.000 |
260.000 |
160.000 |
260.000 |
|
|
|
|
|
DDR3 Specific SPD Attributes |
|
|
|
|
Write Recovery Time, tWR (ns) |
15.000 |
15.000 |
15.000 |
15.000 |
Internal Write to Read Command Delay, tWTR (ns) |
7.500 |
7.500 |
7.500 |
7.500 |
Internal Read to Precharge Command Delay, tRTP (ns) |
7.500 |
7.500 |
7.500 |
7.500 |
Minimum Four Activate Window Delay, tFAW (ns) |
30.000 |
30.000 |
30.000 |
30.000 |
RZQ / 6 Supported |
Yes |
Yes |
Yes |
Yes |
RZQ / 7 Supported |
Yes |
Yes |
Yes |
Yes |
DLL-Off Mode Supported |
Yes |
Yes |
Yes |
Yes |
Maximum Operating Temperature Range (C) |
0-95 |
0-95 |
0-95 |
0-95 |
Refresh Rate at Extended Operating Temperature Range |
2X |
2X |
2X |
2X |
Auto-self Refresh Supported |
Yes |
No |
Yes |
No |
On-die Thermal Sensor Readout Supported |
No |
No |
No |
No |
Partial Array Self Refresh Supported |
No |
No |
No |
No |
Thermal Sensor Present |
No |
No |
No |
No |
Non-standard SDRAM Type |
Standard Monolithic |
Standard Monolithic |
Standard Monolithic |
Standard Monolithic |
Module Type |
SO-DIMM |
SO-DIMM |
SO-DIMM |
SO-DIMM |
Module Height (mm) |
30 |
30 |
30 |
30 |
Module Thickness (front), (mm) |
2 |
2 |
2 |
2 |
Module Thickness (back), (mm) |
2 |
2 |
2 |
2 |
Module Width (mm) |
67.6 |
67.6 |
67.6 |
67.6 |
Reference Raw Card Used |
Raw Card F Rev. 0 |
Raw Card B Rev. 3 |
Raw Card F Rev. 0 |
Raw Card B Rev. 3 |
DRAM Manufacture |
|
Hynix Semiconductor (Hyundai Electronics) |
|
Hynix Semiconductor (Hyundai Electronics) |
|
|
|
|
|
XMP Attributes |
|
|
|
|
XMP Revision |
1.2 |
|
1.2 |
|
Enthusiast / Certified Profile |
|
|
|
|
Module voltage |
1.35V |
|
1.35V |
|
Clock speed (MHz) |
800 |
|
800 |
|
Transfer Speed (MHz) |
DDR3-1600 |
|
DDR3-1600 |
|
Bandwidth (MB/s) |
PC3-12800 |
|
PC3-12800 |
|
Minimum clock cycle time, tCK (ns) |
1.250 |
|
1.250 |
|
Supported CAS latencies |
5 6 7 8 9 10 |
|
5 6 7 8 9 10 |
|
Minimum CAS latency time, tAA (ns) |
11.250 |
|
11.250 |
|
Minimum RAS to CAS delay time, tRCD (ns) |
11.250 |
|
11.250 |
|
Minimum row precharge time, tRP (ns) |
11.250 |
|
11.250 |
|
Minimum active to precharge time, tRAS (ns) |
30.000 |
|
30.000 |
|
Supported timing at highest clock speed |
9-9-9-24 |
|
9-9-9-24 |
|
Minimum Row Active to Row Active Delay, tRRD (ns) |
5.500 |
|
5.500 |
|
Minimum Active to Auto-Refresh Delay, tRC (ns) |
41.250 |
|
41.250 |
|
Minimum Recovery Delay, tRFC (ns) |
160.000 |
|
160.000 |
|
Minimum Write Recovery time, tWR (ns) |
15.000 |
|
15.000 |
|
Minimum Write to Read CMD Delay, tWTR (ns) |
7.500 |
|
7.500 |
|
Minimum Read to Pre-charge CMD Delay, tRTP (ns) |
7.500 |
|
7.500 |
|
Minimum Four Activate Window Delay, tFAW (ns) |
30.000 |
|
30.000 |
|
Maximum Average Periodic Refresh Interval, tREFI (us) |
7.875 |
|
7.875 |
|
Write to Read CMD Turn-around Time Optimizations |
No adjustment |
|
No adjustment |
|
Read to Write CMD Turn-around Time Optimizations |
No adjustment |
|
No adjustment |
|
Back 2 Back CMD Turn-around Time Optimizations |
No adjustment |
|
No adjustment |
|
System CMD Rate Mode |
0T |
|
0T |
|