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Memory Summary For MAHARNAB-PC
Number of Memory Devices: 2	Total Physical Memory: 2485 MB (0 MB)
				Total Available Physical Memory: 941 MB
				Memory Load: 62%	

ItemModule #1Module #2
Ram Type DDR3 DDR3
Maximum Clock Speed (MHz) 666.67 (JEDEC) 666.67 (JEDEC)
Maximum Transfer Speed (MHz) DDR3-1333 DDR3-1333
Maximum Bandwidth (MB/s) PC3-10666 PC3-10666
Memory Capacity (MB) 1024 2048
Jedec Manufacture Name Micron Technology Samsung
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SPD Revision 1.0 1.0
Registered No No
ECC No No
DIMM Slot # 1 3
Manufactured Week 16 of Year 2010 Week 19 of Year 2010
Module Part # 8JSF12864HZ-1G4F1 M471B5673FH0-CH9
Module Revision 0x4631 0x0
Module Serial # 0x33F6964C 0x93CE97E6
Module Manufacturing Location 15 2
# of Row Addressing Bits 14 14
# of Column Addressing Bits 10 10
# of Banks 8 8
# of Ranks 1 2
Device Width in Bits 8 8
Bus Width in Bits 64 64
Module Voltage 1.5V 1.5V
CAS Latencies Supported 5 6 7 8 9 10 5 6 7 8 9
Timings @ Max Frequency (JEDEC) 9-9-9-24 9-9-9-24
Maximum frequency (MHz) 666.67 666.67
Maximum Transfer Speed (MHz) DDR3-1333 DDR3-1333
Maximum Bandwidth (MB/s) PC3-10666 PC3-10666
Minimum Clock Cycle Time, tCK (ns) 1.500 1.500
Minimum CAS Latency Time, tAA (ns) 13.125 13.125
Minimum RAS to CAS Delay, tRCD (ns) 13.125 13.125
Minimum Row Precharge Time, tRP (ns) 13.125 13.125
Minimum Active to Precharge Time, tRAS (ns) 36.000 36.000
Minimum Row Active to Row Active Delay, tRRD (ns) 6.000 6.000
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) 49.125 49.125
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) 110.000 110.000
DDR3 Specific SPD Attributes
Write Recovery Time, tWR (ns) 15.000 15.000
Internal Write to Read Command Delay, tWTR (ns) 7.500 7.500
Internal Read to Precharge Command Delay, tRTP (ns) 7.500 7.500
Minimum Four Activate Window Delay, tFAW (ns) 30.000 30.000
RZQ / 6 Supported No Yes
RZQ / 7 Supported Yes Yes
DLL-Off Mode Supported Yes Yes
Maximum Operating Temperature (C) 95 95
Refresh Rate at Extended Operating Temperature Range 1X 1X
Auto-self Refresh Supported Yes No
On-die Thermal Sensor Readout Supported No No
Partial Array Self Refresh Supported No No
Thermal Sensor Present Yes No
Non-standard SDRAM Type Standard Monolithic Standard Monolithic
Module Type SO-DIMM SO-DIMM
Module Height (mm) 30 30
Module Thickness (front), (mm) 2 2
Module Thickness (back), (mm) 2 2
Module Width (mm) 67.6 67.6
Reference Raw Card Used Raw Card B Rev. 0 Raw Card F Rev. 2
DRAM Manufacture ID 32812 32974
# of DRAM Rows 0 0
# of Registers 0 0
Register Manufacturer
Register Type
Register Revision 0 0