Memory Summary For BALEFIRE
Number of Memory Devices: 2 Total Physical Memory: 6126 MB (6144 MB)
Total Available Physical Memory: 3909 MB
Memory Load: 36%
| Item | Module #1 | Module #2 |
|---|
| Ram Type |
DDR3 |
DDR3 |
| Standard Name |
DDR3-1333 |
DDR3-1333 |
| Module Name |
PC3-10600 |
PC3-10600 |
| Memory Capacity (MB) |
2048 |
4096 |
| Bus Clockspeed (Mhz) |
666.67 |
666.67 |
| Jedec Manufacture Name |
Ramaxel Technology |
Hynix Semiconductor (Hyundai Electronics) |
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| SPD Revision |
1.1 |
1.0 |
| Registered |
No |
No |
| ECC |
No |
No |
| DIMM Slot # |
1 |
3 |
| Manufactured |
Year 0 |
Year 0 |
| Module Part # |
RMR1810EC58E8F1333 |
HMT351U6BFR8C-H9 |
| Module Revision |
0x4100 |
0x4E30 |
| Module Serial # |
0x41D6A831 |
0x3594F84E |
| Module Manufacturing Location |
1 |
1 |
| # of Row Addressing Bits |
15 |
15 |
| # of Column Addressing Bits |
10 |
10 |
| # of Banks |
8 |
8 |
| # of Ranks |
1 |
2 |
| Device Width in Bits |
8 |
8 |
| Bus Width in Bits |
64 |
64 |
| Module Voltage |
1.5V |
1.5V |
| CAS Latencies Supported |
5 6 7 8 9 10 |
6 7 8 9 |
| Timings @ Max Frequency |
9-9-9-24 |
9-9-9-24 |
| Minimum Clock Cycle Time, tCK (ns) |
1.500 |
1.500 |
| Minimum CAS Latency Time, tAA (ns) |
13.125 |
13.125 |
| Minimum RAS to CAS Delay, tRCD (ns) |
13.125 |
13.125 |
| Minimum Row Precharge Time, tRP (ns) |
13.125 |
13.125 |
| Minimum Active to Precharge Time, tRAS (ns) |
36.000 |
36.000 |
| Minimum Row Active to Row Active Delay, tRRD (ns) |
6.000 |
6.000 |
| Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) |
49.125 |
49.125 |
| Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) |
160.000 |
160.000 |
| |
|
|
| DDR3 Specific SPD Attributes |
|
|
| Write Recovery Time, tWR (ns) |
15.000 |
15.000 |
| Internal Write to Read Command Delay, tWTR (ns) |
7.500 |
7.500 |
| Internal Read to Precharge Command Delay, tRTP (ns) |
7.500 |
7.500 |
| Minimum Four Activate Window Delay, tFAW (ns) |
30.000 |
30.000 |
| RZQ / 6 Supported |
Yes |
Yes |
| RZQ / 7 Supported |
Yes |
Yes |
| DLL-Off Mode Supported |
Yes |
Yes |
| Maximum Operating Temperature (C) |
95 |
95 |
| Refresh Rate at Extended Operating Temperature Range |
1X |
1X |
| Auto-self Refresh Supported |
Yes |
Yes |
| On-die Thermal Sensor Readout Supported |
No |
No |
| Partial Array Self Refresh Supported |
Yes |
No |
| Thermal Sensor Present |
No |
No |
| Non-standard SDRAM Type |
Standard Monolithic |
Standard Monolithic |
| Module Type |
UDIMM |
UDIMM |
| Module Height (mm) |
30 |
30 |
| Module Thickness (front), (mm) |
2 |
2 |
| Module Thickness (back), (mm) |
1 |
2 |
| Module Width (mm) |
133.5 |
133.5 |
| Reference Raw Card Used |
Raw Card A Rev. 0 |
Raw Card B Rev. 0 |
| DRAM Manufacture ID |
766 |
32941 |
| # of DRAM Rows |
0 |
0 |
| # of Registers |
0 |
0 |
| Register Manufacturer |
|
|
| Register Type |
|
|
| Register Revision |
0 |
0 |