RAMMon v1.0 Build: 1006 built with SysInfo v1.0 Build: 1028
PassMark (R) Software - www.passmark.com

Memory Summary For OC-PC
Number of Memory Devices: 2	Total Physical Memory: 8144 MB (8192 MB)
				Total Available Physical Memory: 5994 MB
				Memory Load: 26%	

ItemSlot #1Slot #2Slot #3Slot #4
Ram Type Not Populated DDR3 Not Populated DDR3
Standard Name DDR3-1333 DDR3-1333
Module Name PC3-10600 PC3-10600
Memory Capacity (MB) 4096 4096
Bus Clockspeed (Mhz) 666.67 666.67
Jedec Manufacture Name Corsair Corsair
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SPD Revision 1.0 1.0
Registered No No
ECC No No
DIMM Slot # 2 4
Manufactured Year 0 Year 0
Module Part # CMZ8GX3M2A1866C9 CMZ8GX3M2A1866C9
Module Revision 0x0 0x0
Module Serial # 0x0 0x0
Module Manufacturing Location 1 1
# of Row Addressing Bits 15 15
# of Column Addressing Bits 10 10
# of Banks 8 8
# of Ranks 2 2
Device Width in Bits 8 8
Bus Width in Bits 64 64
Module Voltage 1.5V 1.5V
CAS Latencies Supported 6 7 8 9 6 7 8 9
Timings @ Max Frequency 9-9-9-24 9-9-9-24
Minimum Clock Cycle Time, tCK (ns) 1.500 1.500
Minimum CAS Latency Time, tAA (ns) 13.500 13.500
Minimum RAS to CAS Delay, tRCD (ns) 13.500 13.500
Minimum Row Precharge Time, tRP (ns) 13.500 13.500
Minimum Active to Precharge Time, tRAS (ns) 36.000 36.000
Minimum Row Active to Row Active Delay, tRRD (ns) 7.500 7.500
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) 50.625 50.625
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) 160.000 160.000
DDR3 Specific SPD Attributes
Write Recovery Time, tWR (ns) 15.000 15.000
Internal Write to Read Command Delay, tWTR (ns) 7.500 7.500
Internal Read to Precharge Command Delay, tRTP (ns) 7.500 7.500
Minimum Four Activate Window Delay, tFAW (ns) 37.500 37.500
RZQ / 6 Supported Yes Yes
RZQ / 7 Supported Yes Yes
DLL-Off Mode Supported Yes Yes
Maximum Operating Temperature (C) 95 95
Refresh Rate at Extended Operating Temperature Range 1X 1X
Auto-self Refresh Supported No No
On-die Thermal Sensor Readout Supported No No
Partial Array Self Refresh Supported Yes Yes
Thermal Sensor Present No No
Non-standard SDRAM Type Standard Monolithic Standard Monolithic
Module Type UDIMM UDIMM
Module Height (mm) 46 46
Module Thickness (front), (mm) 2 2
Module Thickness (back), (mm) 2 2
Module Width (mm) 133.5 133.5
Reference Raw Card Used Raw Card B Rev. 0 Raw Card B Rev. 0
DRAM Manufacture ID 0 0
# of DRAM Rows 0 0
# of Registers 0 0
Register Manufacturer
Register Type
Register Revision 0 0
XMP Attributes
XMP Revision 1.2 1.2
Enthusiast / Certified Profile
Module voltage 1.50V 1.50V
Clock speed (Mhz) 933.33 933.33
Minimum clock cycle time, tCK (ns) 1.071 1.071
Supported CAS latencies 6 9 6 9
Minimum CAS latency time, tAA (ns) 9.643 9.643
Minimum RAS to CAS delay time, tRCD (ns) 10.714 10.714
Minimum row precharge time, tRP (ns) 9.643 9.643
Minimum active to precharge time, tRAS (ns) 28.929 28.929
Supported timing at highest clock speed 9-10-9-27 9-10-9-27
Minimum Row Active to Row Active Delay, tRRD (ns) 7.500 7.500
Minimum Active to Auto-Refresh Delay, tRC (ns) 50.643 50.643
Minimum Recovery Delay, tRFC (ns) 160.000 160.000
Minimum Write Recovery time, tWR (ns) 15.000 15.000
Minimum Write to Read CMD Delay, tWTR (ns) 7.500 7.500
Minimum Read to Pre-charge CMD Delay, tRTP (ns) 7.500 7.500
Minimum Four Activate Window Delay, tFAW (ns) 37.500 37.500
Maximum Average Periodic Refresh Interval, tREFI (us) 7.786 7.786
Write to Read CMD Turn-around Time Optimizations No adjustment No adjustment
Read to Write CMD Turn-around Time Optimizations No adjustment No adjustment
Back 2 Back CMD Turn-around Time Optimizations No adjustment No adjustment
System CMD Rate Mode 2T 2T