RAMMon v1.0 Build: 1011 built with SysInfo v1.0 Build: 1044
PassMark (R) Software - www.passmark.com

Memory Summary For ONDREJ-PC
Number of Memory Devices: 2	Total Physical Memory: 8128 MB (8192 MB)
				Total Available Physical Memory: 5255 MB
				Memory Load: 35%
ItemSlot #1Slot #2Slot #3Slot #4
Ram Type DDR3 Not Populated DDR3 Not Populated
Maximum Clock Speed (MHz) 933.33 (XMP) 933.33 (XMP)
Maximum Transfer Speed (MHz) DDR3-1866 DDR3-1866
Maximum Bandwidth (MB/s) PC3-14900 PC3-14900
Memory Capacity (MB) 4096 4096
Jedec Manufacture Name Crucial Technology Crucial Technology
Search Amazon.com Search! Search!
SPD Revision 1.1 1.1
Registered No No
ECC No No
DIMM Slot # 1 3
Manufactured
Module Part # BLT4G3D1869DT1TX0. BLT4G3D1869DT1TX0.
Module Revision 0x100 0x100
Module Serial # 0xA4073274 0xA900FFBD
Module Manufacturing Location 0 0
# of Row Addressing Bits 15 15
# of Column Addressing Bits 10 10
# of Banks 8 8
# of Ranks 2 2
Device Width in Bits 8 8
Bus Width in Bits 64 64
Module Voltage 1.5V 1.5V
CAS Latencies Supported 6 8 9 6 8 9
Timings @ Max Frequency (JEDEC) 9-9-9-24 9-9-9-24
Maximum frequency (MHz) 666.67 666.67
Maximum Transfer Speed (MHz) DDR3-1333 DDR3-1333
Maximum Bandwidth (MB/s) PC3-10600 PC3-10600
Minimum Clock Cycle Time, tCK (ns) 1.500 1.500
Minimum CAS Latency Time, tAA (ns) 13.500 13.500
Minimum RAS to CAS Delay, tRCD (ns) 13.500 13.500
Minimum Row Precharge Time, tRP (ns) 13.500 13.500
Minimum Active to Precharge Time, tRAS (ns) 36.000 36.000
Minimum Row Active to Row Active Delay, tRRD (ns) 6.000 6.000
Minimum Auto-Refresh to Active/Auto-Refresh Time, tRC (ns) 49.500 49.500
Minimum Auto-Refresh to Active/Auto-Refresh Command Period, tRFC (ns) 160.000 160.000
DDR3 Specific SPD Attributes
Write Recovery Time, tWR (ns) 15.000 15.000
Internal Write to Read Command Delay, tWTR (ns) 7.500 7.500
Internal Read to Precharge Command Delay, tRTP (ns) 7.500 7.500
Minimum Four Activate Window Delay, tFAW (ns) 30.000 30.000
RZQ / 6 Supported No No
RZQ / 7 Supported Yes Yes
DLL-Off Mode Supported Yes Yes
Maximum Operating Temperature Range (C) 0-95 0-95
Refresh Rate at Extended Operating Temperature Range 2X 2X
Auto-self Refresh Supported Yes Yes
On-die Thermal Sensor Readout Supported No No
Partial Array Self Refresh Supported No No
Thermal Sensor Present No No
Non-standard SDRAM Type Standard Monolithic Standard Monolithic
Module Type UDIMM UDIMM
Module Height (mm) 30 30
Module Thickness (front), (mm) 2 2
Module Thickness (back), (mm) 2 2
Module Width (mm) 133.5 133.5
Reference Raw Card Used Raw Card B Rev. 0 Raw Card B Rev. 0
DRAM Manufacture ID 32812 32812
# of DRAM Rows 0 0
# of Registers 0 0
Register Manufacturer
Register Type
Register Revision 0 0
XMP Attributes
XMP Revision 1.3 1.3
Enthusiast / Certified Profile
Module voltage 1.50V 1.50V
Clock speed (MHz) 933.33 933.33
Transfer Speed (MHz) DDR3-1866 DDR3-1866
Bandwidth (MB/s) PC3-14900 PC3-14900
Minimum clock cycle time, tCK (ns) 1.071 1.071
Supported CAS latencies 6 7 8 9 10 6 7 8 9 10
Minimum CAS latency time, tAA (ns) 9.429 9.429
Minimum RAS to CAS delay time, tRCD (ns) 9.429 9.429
Minimum row precharge time, tRP (ns) 9.429 9.429
Minimum active to precharge time, tRAS (ns) 28.143 28.143
Supported timing at highest clock speed 9-9-9-27 9-9-9-27
Minimum Row Active to Row Active Delay, tRRD (ns) 6.000 6.000
Minimum Active to Auto-Refresh Delay, tRC (ns) 49.500 49.500
Minimum Recovery Delay, tRFC (ns) 160.000 160.000
Minimum Write Recovery time, tWR (ns) 15.000 15.000
Minimum Write to Read CMD Delay, tWTR (ns) 7.500 7.500
Minimum Read to Pre-charge CMD Delay, tRTP (ns) 7.500 7.500
Minimum Four Activate Window Delay, tFAW (ns) 30.000 30.000
Maximum Average Periodic Refresh Interval, tREFI (us) 7.786 7.786
Write to Read CMD Turn-around Time Optimizations No adjustment No adjustment
Read to Write CMD Turn-around Time Optimizations No adjustment No adjustment
Back 2 Back CMD Turn-around Time Optimizations No adjustment No adjustment
System CMD Rate Mode 2T 2T