advanced packaging

Multibeam Corp.’s first Taiwan order for its newly launched MBX multi-column electron-beam lithography platform is a notable development in the race to make semiconductor experimentation faster, more flexible, and less dependent on expensive photomasks. National Tsing Hua University’s College of...

Vietnam’s semiconductor ambitions are entering a more demanding phase: the country must now convert policy targets, foreign investment, and a large pool of technically capable young people into an industry that can design, package, test, and eventually manufacture strategically important chips...

South Korea’s newly announced semiconductor buildout in the Gwangju–Jeonnam region is being pitched as more than a second manufacturing hub: Gwangju Institute of Science and Technology president Lim Ki-chul says it could become a long-term center for AI-chip research, talent development and...

Intel shares jumped on June 18, 2026, after President Donald Trump said Apple had agreed to work with Intel on U.S. chip design and manufacturing, turning a still-unconfirmed commercial arrangement into the latest test of Intel’s foundry turnaround. The market heard “Apple” and immediately...

Taiwan’s semiconductor ecosystem has become the indispensable middle mile of modern computing, with the island controlling more than 60 percent of global foundry revenue and more than 90 percent of leading-edge chip production as of the latest trade and industry reporting. That is not merely a...