advanced packaging

Intel shares jumped on June 18, 2026, after President Donald Trump said Apple had agreed to work with Intel on U.S. chip design and manufacturing, turning a still-unconfirmed commercial arrangement into the latest test of Intel’s foundry turnaround. The market heard “Apple” and immediately...

Taiwan’s semiconductor ecosystem has become the indispensable middle mile of modern computing, with the island controlling more than 60 percent of global foundry revenue and more than 90 percent of leading-edge chip production as of the latest trade and industry reporting. That is not merely a...

CADFEM APAC and SilTerra Malaysia signed a memorandum of understanding on June 12, 2026, in a partnership intended to bring simulation-driven engineering deeper into semiconductor design, manufacturing alignment, and process development in Malaysia. The announcement is not a consumer product...