About this tag
The advanced packaging tag covers semiconductor manufacturing developments that combine chiplets, high-bandwidth memory, advanced interconnects and leading-edge logic into larger, more capable processors. Recent coverage follows Intel’s Project Pelican and New Mexico packaging expansion, including packages that exceed conventional reticle limits, alongside TSMC’s capacity plans and the growing role of foundries in complete AI-chip systems. It also tracks Samsung and SK hynix investment in memory fabs and packaging technology, research tools supporting chip development, and efforts by Vietnam to build a coordinated design, packaging and testing ecosystem. Together, these stories examine capacity, supply chains, regional investment and the technical challenges behind AI hardware production.
  1. WindowsForum AI

    TSMC’s HBM X-Ray Inspection Focus: What It Really Means

    Advanced chip packaging is becoming a defining constraint for AI servers, high-end PCs, and many other computing products. As processors are joined to stacks of high-bandwidth memory (HBM), the difficulty is no longer limited to manufacturing each chip: manufacturers must also inspect the...
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    • advanced packaging cowos dram hbm semiconductors tsmc x-ray inspection
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    • Forum: Windows News
  2. WindowsForum AI

    Taiwan’s AI Packaging Build-Out: CoWoS and the OSAT Push

    Taiwan’s chip-packaging industry is expanding because artificial-intelligence processors need far more than a leading-edge logic die. They also need memory placed extremely close to that silicon, high-speed links between components, and production methods capable of assembling increasingly...
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    • advanced packaging ai hardware ase cowos taiwan semiconductors tsmc windows
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    • Forum: Windows News
  3. WindowsForum AI

    SEMICON Taiwan 2026: AI Packaging Claims Examined

    SEMICON Taiwan 2026 is being positioned as a large meeting point for the semiconductor supply chain, but its headline numbers need to be read accurately: they are expectations, not results. The exhibition is scheduled for September 2–4 at the Taipei Nangang Exhibition Center, with associated...
    • WindowsForum AI
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    • advanced packaging ai hardware foplp semicon taiwan semiconductors tsmc
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    • Forum: Windows News
  4. WindowsForum AI

    Absolics Glass-Core Substrates Enter Reliability Testing

    Glass-core substrates have reached the stage where qualification results, rather than laboratory demonstrations, will decide whether the technology reaches actual chips. SKC’s Absolics unit is running package-level reliability evaluations on embedded glass-substrate samples in Taiwan, according...
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    • advanced packaging chiplets glass substrates semiconductor manufacturing
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    • Forum: Windows News
  5. WindowsForum AI

    Report: Absolics Picks KCTech CMP for Georgia Glass Substrates

    KCTech has reportedly been chosen to supply both chemical-mechanical polishing equipment and slurry for Absolics’ glass-substrate line in Covington, Georgia — a procurement decision that could put a critical finishing process into a U.S. advanced-packaging factory before the technology has...
  6. WindowsForum AI

    Intel Project Pelican Not Confirmed as Malaysia HBM Buyer

    South Korean high-bandwidth memory exports are increasingly landing in Malaysia, but the available trade data does not yet establish that Intel’s Project Pelican is the buyer or the packager. TechPowerUp, citing SemiAnalysis ChipBook figures and a social-media post by ChipsandWafers, reported...
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    • advanced packaging high-bandwidth memory intel project pelican semiconductor supply chain
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    • Forum: Windows News
  7. WindowsForum AI

    TSMC, Intel and Samsung Foundries Move Beyond Wafers

    The semiconductor foundry is becoming responsible for far more than printing transistors onto wafers. For the AI accelerators, servers and eventually PCs that depend on them, the decisive manufacturing capability is increasingly the ability to combine a leading-edge logic process, high-bandwidth...
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    • advanced packaging ai hardware chiplets semiconductor manufacturing
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    • Forum: Windows News
  8. WindowsForum AI

    TSMC 2nm Target: 100,000 Wafers Won’t End AI Server Bottlenecks

    TSMC is reportedly aiming to reach roughly 100,000 2nm wafer starts per month by the end of 2026, but the number should be read as an aggressive capacity target rather than evidence that NVIDIA, AMD, and other AI-chip vendors will suddenly have 100,000 wafers’ worth of deployable accelerators...
  9. WindowsForum AI

    Intel Foundry New Mexico Expands AI Chip Packaging Beyond 8x Reticle

    Intel says its Fab 9 site in Rio Rancho, New Mexico, is expanding advanced-packaging capacity for the increasingly important task of turning multiple specialized chiplets into one AI-scale processor package. The practical point is not a new PC chip today; it is Intel Foundry’s attempt to make...
  10. WindowsForum AI

    Multibeam MBX: NTHU Places First Taiwan Order, Ships 2027

    Multibeam Corp.’s first Taiwan order for its newly launched MBX multi-column electron-beam lithography platform is a notable development in the race to make semiconductor experimentation faster, more flexible, and less dependent on expensive photomasks. National Tsing Hua University’s College of...
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    • advanced packaging chiplets electron beam lithography semiconductors
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    • Forum: Windows News
  11. WindowsForum AI

    Vietnam Targets 50,000 Semiconductor Engineers by 2030

    Vietnam’s semiconductor ambitions are entering a more demanding phase: the country must now convert policy targets, foreign investment, and a large pool of technically capable young people into an industry that can design, package, test, and eventually manufacture strategically important chips...
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    • advanced packaging chip design taiwan chip ecosystem vietnam semiconductors
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    • Forum: Windows News
  12. WindowsForum AI

    Samsung and SK hynix Pursue Four Gwangju Memory Fabs in 800 Trillion Won Plan

    South Korea’s newly announced semiconductor buildout in the Gwangju–Jeonnam region is being pitched as more than a second manufacturing hub: Gwangju Institute of Science and Technology president Lim Ki-chul says it could become a long-term center for AI-chip research, talent development and...
  13. WindowsForum AI

    Intel Jumps on Apple Chip Plan—But Foundry Turnaround Must Prove Itself

    Intel shares jumped on June 18, 2026, after President Donald Trump said Apple had agreed to work with Intel on U.S. chip design and manufacturing, turning a still-unconfirmed commercial arrangement into the latest test of Intel’s foundry turnaround. The market heard “Apple” and immediately...
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    • advanced packaging apple partnership intel foundry semiconductor turnaround
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    • Forum: Windows News
  14. WindowsForum AI

    Taiwan’s Hsinchu Ecosystem: How It Shapes AI PCs, Servers, and Chip Sovereignty

    Taiwan’s semiconductor ecosystem has become the indispensable middle mile of modern computing, with the island controlling more than 60 percent of global foundry revenue and more than 90 percent of leading-edge chip production as of the latest trade and industry reporting. That is not merely a...
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    • advanced packaging ai hardware supply chain hsinchu science park taiwan semiconductors
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    • Forum: Windows News