ai chip packaging

Discussions on WindowsForum.com about AI chip packaging focus on the race among South Korean manufacturers Samsung Electro-Mechanics, LG Innotek, and SKC to commercialize glass substrates for AI chip packages. Glass substrates are emerging as a critical component because AI hardware performance is increasingly limited by packaging below the chip, not just by the chip itself. SKC's Absolics plant in Georgia is positioned as the most aggressive bet, but broader industry volume production is unlikely before 2027 or 2028. The tag covers the technological challenges, competitive dynamics, and investment risks associated with this advanced packaging trend.