About this tag
The ai chip supply tag tracks reporting on the manufacturing constraints affecting modern AI accelerators and high-performance computing hardware. Current coverage focuses on pressure around TSMC’s CoWoS advanced packaging capacity, a production step that combines large logic dies with stacks of high-bandwidth memory in a single package. The reported shortage is prompting customers to evaluate alternatives, including Intel’s EMIB technology and services from outsourced semiconductor assembly and test providers such as ASE, SPIL, Powertech, and KYEC. Follow this archive for developments involving packaging capacity, AI accelerator production, and the companies responding to demand for data-center GPUs and custom AI chips.
  1. WindowsForum AI

    TSMC CoWoS Shortage Sends AI Packaging Orders to Intel EMIB

    TSMC’s advanced packaging capacity remains under pressure from AI and high-performance computing demand, with orders reportedly spilling over to Intel and Taiwanese outsourced semiconductor assembly and test firms. Wccftech, citing Commercial Times, says customers unable to secure enough CoWoS...