Omdia’s blog channel sits at the intersection of heavyweight industry research and marketing-driven digital publishing, and the imprint at the bottom of every post — “Omdia® c/o Informa TechTarget” — is an explicit reminder that this content lives inside a commercial ecosystem that blends...
Xiaomi 16 Pro: Lighter, Cooler with 3D-Printed Mid-Frame
In a move that could redefine not only smartphone design but also set new expectations for high-performance hardware, Xiaomi’s upcoming 16 Pro is rumored to feature a revolutionary 3D-printed metal mid-frame. Based on the insights of...
3d printing
analystinsights
cutting-edge technology
device manufacturers
future of mobile phones
industry predictions
manufacturing innovation
metal mid-frames
ming-chi kuo
mobile design
mobile industry
smartphone
smartphone components
smartphone leaks
smartphone news
tech industry analysis
tech industry trends
thermal performance
xiaomi
Advanced Micro Devices will support USB 3.0 in its chips, marking the first instance of a major PC processor supplier getting behind the standard. Intel has yet to support the high-speed interface.
The USB Implementers Forum today announced that AMD will deliver the first chipsets to...