Xiaomi 16 Pro: Lighter, Cooler with 3D-Printed Mid-Frame
In a move that could redefine not only smartphone design but also set new expectations for high-performance hardware, Xiaomi’s upcoming 16 Pro is rumored to feature a revolutionary 3D-printed metal mid-frame. Based on the insights of...
3d printing
3d printing technology
analystinsights
cutting-edge technology
future of mobile phones
industry predictions
innovative manufacturing
metal mid-frames
ming-chi kuo
mobile device design
mobile industry
smartphone components
smartphone design
smartphone engineering
smartphone leak
smartphone manufacturers
smartphone news
tech industry analysis
tech market trends
tech trends
thermal performance
xiaomi 16 pro
Advanced Micro Devices will support USB 3.0 in its chips, marking the first instance of a major PC processor supplier getting behind the standard. Intel has yet to support the high-speed interface.
The USB Implementers Forum today announced that AMD will deliver the first chipsets to...
adoption
amd
analystinsights
backward compatibility
chipsets
energy frugal
external hard drives
fusion chips
high speed
integration
laptops
market impact
pc processors
peripheral devices
power efficiency
tech years
thunderbolt
transfer rates
usb 3.0