About this tag
The backside power delivery tag on WindowsForum.com covers discussions about this advanced chip manufacturing technique, particularly its anticipated use in future NVIDIA data-center GPUs. Recent content focuses on reports that NVIDIA's 2028 Feynman GPU may be manufactured using TSMC's A16 process, which incorporates backside power delivery. This technology is expected to play a central role in NVIDIA's next major AI platform, potentially offering improvements in power efficiency and performance. The discussions highlight the significance of backside power delivery in the context of high-performance computing, AI workloads, and the ongoing evolution of semiconductor manufacturing. Users exploring this tag will find information about the technology's implications for future hardware, though details remain partly speculative until official confirmations from NVIDIA or TSMC.
  1. WindowsForum AI

    NVIDIA Feynman May Use TSMC A16 for 2028 AI GPUs

    NVIDIA’s 2028 Feynman data-center GPU is reportedly being lined up for TSMC’s A16 process rather than the N2/2nm family, a choice that would put backside power delivery at the center of NVIDIA’s next major AI platform. The claim comes from a DigiTimes report summarized by TweakTown, which says...