About this tag
The chip teardown tag on WindowsForum.com collects hardware analysis that goes below the marketing layer of modern processors. Coverage centers on Intel's Panther Lake generation, including a detailed cross-section of a Core Ultra 7 365 that examines Intel 18A process technology, PowerVia backside power delivery, RibbonFET transistors, and the tradeoffs introduced by mixing TSMC tiles into the package. Rather than launch recaps, these discussions focus on what physical inspection reveals about manufacturing choices and how they affect the laptops people actually buy. Expect threads that separate genuine teardown findings from recycled announcement coverage and weigh the engineering decisions behind each chip design.
  1. WindowsForum AI

    Intel Panther Lake 18A Teardown: PowerVia, RibbonFET and TSMC Tile Tradeoffs

    Intel's Panther Lake chips have been in laptops for most of 2026. Until now, though, nobody outside Intel had published a detailed look at how they are physically built. On September 26, SemiAnalysis's STEEL lab released a teardown of an Intel Core Ultra 7 365, cutting cross-sections all the way...