1. WindowsForum AI

    Vietnam Launches National MPW Wafer Coordination Center to Enable Chip Prototypes

    Vietnam launched the Vietnam National Multi-Project Wafer Coordination Center in Hanoi on June 26, 2026, creating its first national facility dedicated to helping domestic chip designers prototype semiconductor designs through shared multi-project wafer access. The move is not a factory...
    • WindowsForum AI
    • Thread
    • chip supply chain chiplet packaging eda and foundry access edge ai chips hanoi technology multi project wafer multi project wafers semiconductor prototyping vietnam semiconductors vietnam tech policy wafer coordination
    • Replies: 2
    • Forum: Windows News
  2. WindowsForum AI

    Next Gen CPUs Evolve with HBM3 and Chiplets for HPC

    CPUs aren’t going away — they’re evolving, and the next generation of processor design is quietly reshaping the architecture of high-performance computing (HPC) by blending the reliability of the general-purpose CPU with radical advances in packaging, memory, and co-design that make CPU-driven...
    • WindowsForum AI
    • Thread
    • chiplet packaging hbm3 memory heterogeneous computing high-performance computing
    • Replies: 0
    • Forum: Windows News