chiplets

The chiplets tag covers developments in semiconductor design and manufacturing that combine multiple dies with advanced packaging, package interconnects, high-bandwidth memory, and leading-edge logic processes. Coverage examines how foundries such as TSMC, Intel, and Samsung are expanding beyond wafer fabrication to deliver complete systems for AI accelerators, servers, and future PCs. It also follows related advances in design software, AI-assisted fabrication, and semiconductor research infrastructure, including maskless electron-beam lithography intended to make experimentation more flexible and reduce dependence on expensive photomasks. These stories provide context on the technologies, manufacturing strategies, and research tools influencing the next generation of chip-based systems.