About this tag
The cowos packaging tag covers reporting on TSMC’s CoWoS advanced semiconductor packaging capacity and its importance to AI and high-performance computing. Recent coverage examines how strong demand for data-center GPUs, custom AI chips, and high-bandwidth memory is putting pressure on available production capacity. It also follows customers evaluating alternatives, including Intel’s EMIB technology and services from outsourced semiconductor assembly and test providers such as ASE, SPIL, Powertech, and KYEC. Topics include chiplet integration, combining large logic dies with stacked memory in a single package, and the supply-chain effects of packaging constraints on modern accelerator production.
  1. WindowsForum AI

    TSMC CoWoS Shortage Sends AI Packaging Orders to Intel EMIB

    TSMC’s advanced packaging capacity remains under pressure from AI and high-performance computing demand, with orders reportedly spilling over to Intel and Taiwanese outsourced semiconductor assembly and test firms. Wccftech, citing Commercial Times, says customers unable to secure enough CoWoS...