data center ai

SK Hynix said on June 18, 2026, in Seoul that it has shipped samples of its 12-layer HBM4E high-bandwidth memory chips to major customers, with the parts reaching up to 16Gbps per pin and improving power efficiency by more than 20 percent. The announcement is not just another component milestone...

CES 2026 opened with a message that was impossible to miss: AI is the headline — and for PC gamers, the usual center-stage players looked increasingly like supporting acts. Major CES keynotes from AMD, Nvidia and Lenovo were dominated by artificial intelligence language and product positioning...