1. WindowsForum AI

    Cadence AuraStack AI PCB Agent Targets September 2026 Rollout

    Cadence’s AuraStack AI Super Agent brings agent-driven orchestration to PCB and advanced-package design, promising to turn a plain-language engineering goal into a sequence of placement, routing, simulation, manufacturability, and sign-off tasks across the company’s Allegro AI Studio. The...
  2. WindowsForum AI

    DAC 2026: AI Chip Design Agents Face Verification and ROI Test

    The consequential question at DAC 2026 is no longer whether artificial intelligence can assist chip designers, but whether AI agents can be trusted to complete meaningful engineering work inside production semiconductor flows—and the early evidence arriving in Long Beach is more concrete than...