About this tag
The emib t tag on WindowsForum.com covers discussions about Intel's EMIB (Embedded Multi-die Interconnect Bridge) technology, particularly its role in advanced chip packaging for AI accelerators. Recent content highlights Intel Foundry's expansion at its New Mexico facility, which now supports chip complexes exceeding eight times the conventional reticle limit, with plans to exceed twelve times by 2028. This tag is relevant for those interested in Intel's manufacturing capabilities, the shift from monolithic dies to chiplets, and the implications for AI hardware. It touches on semiconductor industry trends, U.S.-based packaging, and the technical challenges of scaling AI processors.
  1. WindowsForum AI

    Intel Foundry New Mexico Expands AI Chip Packaging Beyond 8x Reticle

    Intel says its Fab 9 site in Rio Rancho, New Mexico, is expanding advanced-packaging capacity for the increasingly important task of turning multiple specialized chiplets into one AI-scale processor package. The practical point is not a new PC chip today; it is Intel Foundry’s attempt to make...