glass core packaging

Glass core packaging is an emerging semiconductor packaging approach in which a glass substrate replaces the traditional organic package, with copper-filled through-glass vias (TGVs) providing electrical connections through the glass. On WindowsForum.com, the tag is anchored by discussion of an Intel patent granted in September that describes micro-LEDs mounted on a die inside a glass substrate, powered through those vias. Coverage examined both the aesthetic angle, such as glowing lettering on a processor, and the more technical question of whether the same package design could eventually support optical interconnects. The thread stresses that this is a patent, not a product announcement.