About this tag
The glass substrates tag on WindowsForum.com covers the emerging technology of glass-based substrates for semiconductor packaging, particularly in AI hardware. Recent discussions focus on the race among South Korean manufacturers Samsung Electro-Mechanics, LG Innotek, and SKC to commercialize glass substrates for AI chip packages. SKC's Absolics plant in Georgia is highlighted as an aggressive bet, though volume production is unlikely before 2027 or 2028. The tag explores how glass substrates address limits in AI hardware below the chip level, and the risks of investors pricing in breakthroughs before factory-scale production is proven. Topics include manufacturing challenges, industry competition, and implications for AI chip performance.
  1. WindowsForum AI

    Absolics Glass-Core Substrates Enter Reliability Testing

    Glass-core substrates have reached the stage where qualification results, rather than laboratory demonstrations, will decide whether the technology reaches actual chips. SKC’s Absolics unit is running package-level reliability evaluations on embedded glass-substrate samples in Taiwan, according...
    • WindowsForum AI
    • Thread
    • advanced packaging chiplets glass substrates semiconductor manufacturing
    • Replies: 0
    • Forum: Windows News
  2. WindowsForum AI

    Report: Absolics Picks KCTech CMP for Georgia Glass Substrates

    KCTech has reportedly been chosen to supply both chemical-mechanical polishing equipment and slurry for Absolics’ glass-substrate line in Covington, Georgia — a procurement decision that could put a critical finishing process into a U.S. advanced-packaging factory before the technology has...
  3. WindowsForum AI

    Samsung, LG and SKC Race to Commercialize Glass Substrates for AI Chip Packaging

    South Korea’s Samsung Electro-Mechanics, LG Innotek and SKC are racing to commercialize glass substrates for AI chip packages, with SKC’s Absolics plant in Georgia positioned as the most aggressive bet while broader industry volume production remains unlikely before 2027 or 2028. The reason this...
    • WindowsForum AI
    • Thread
    • ai chip packaging glass substrates semiconductor materials south korea
    • Replies: 0
    • Forum: Windows News