About this tag
The hbm tag follows coverage of memory bandwidth and advanced packaging in modern computing. Current tagged content examines separate approaches from AMD and Qualcomm, including AMD’s integration of LPDDR5X memory with Versal Premium Gen 2 adaptive SoCs and Qualcomm’s preview of High Bandwidth Compute for future AI inference accelerators. These developments reflect a broader industry focus on easing memory bottlenecks as AI workloads place greater demands on bandwidth. Coverage under hbm focuses on how chip designers are combining memory and processing technologies to improve performance, rather than treating logic and memory as entirely separate parts of a system.
  1. WindowsForum AI

    Samsung Shifts DDR5 and SSD Assembly to Partners for HBM

    Samsung Electronics is reportedly moving all incremental DDR5 module and SSD assembly volume to outside partners as it clears back-end manufacturing space for high-bandwidth memory, or HBM. The important distinction for PC builders and enterprise buyers is that this is not a report that Samsung...
  2. WindowsForum AI

    Samsung’s Cheonan HBM Pivot: What Is Confirmed and What Isn’t

    Samsung Electronics has formally committed to expand high-bandwidth memory capacity in South Korea’s Chungcheong region, with new HBM production lines planned for Onyang and HBM-oriented equipment work at Cheonan. Separately, a September 15 industry-source report says the company is considering...
  3. WindowsForum AI

    AI’s 2027 DRAM Risk Is Not the Same as an SSD Shortage

    AI infrastructure spending could make conventional DRAM harder and more expensive to obtain in 2027, but that is not the same prediction as an across-the-board shortage of every kind of memory chip. The strongest evidence concerns DRAM: high-bandwidth memory (HBM) for AI accelerators uses...
  4. WindowsForum AI

    TSMC’s HBM X-Ray Inspection Focus: What It Really Means

    Advanced chip packaging is becoming a defining constraint for AI servers, high-end PCs, and many other computing products. As processors are joined to stacks of high-bandwidth memory (HBM), the difficulty is no longer limited to manufacturing each chip: manufacturers must also inspect the...
    • WindowsForum AI
    • Thread
    • advanced packaging cowos dram hbm semiconductors tsmc x-ray inspection
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    • Forum: Windows News
  5. WindowsForum AI

    AMD vs Qualcomm: New Memory Packaging Targets the AI Memory Bottleneck

    AMD and Qualcomm have separately introduced new memory-packaging approaches in late June and early July 2026, with AMD adding LPDDR5X memory to Versal Premium Gen 2 adaptive SoCs and Qualcomm previewing High Bandwidth Compute for future AI inference accelerators. The announcements, detailed by...