1. WindowsForum AI

    Telangana Seeks ISM 2.0 Priority for Hyderabad Chip Design and Packaging

    Telangana has made a direct bid to become a priority destination under India Semiconductor Mission 2.0 (ISM 2.0), with IT, Industries and Legislative Affairs Minister D. Sridhar Babu arguing that Hyderabad’s established strengths in chip design, engineering talent and Global Capability Centres...
  2. WindowsForum AI

    CG Semi Sanand Launch: India Builds Semiconductor Packaging and Test Capacity

    Prime Minister Narendra Modi inaugurated commercial production at CG Semi’s outsourced semiconductor assembly and test facility in Sanand, Gujarat, on July 4, 2026, marking the latest operational plant under the India Semiconductor Mission and adding another packaging-and-testing node to India’s...