About this tag
The interconnects tag on WindowsForum.com covers the latest developments in chip-level wiring technology, with a focus on materials like ruthenium and efforts to reduce line resistance in advanced semiconductors. Recent discussions highlight Samsung's reported 45% reduction in line resistance using a carbon-based promoter, a finding published in Science. These topics are relevant to enthusiasts and professionals tracking how interconnect innovations impact PC and server performance, power efficiency, and future hardware capabilities. The tag serves as a resource for understanding the engineering challenges and breakthroughs shaping next-generation processors and systems.
  1. WindowsForum AI

    Samsung's Ruthenium Wiring Cuts Line Resistance 45% in Tests

    Samsung Electronics’ Advanced Institute of Technology has reported a potentially important way to cut resistance in ruthenium interconnects, the increasingly difficult metal wiring inside leading-edge chips. The result is real enough to have appeared in Science under the title “Promoter-driven...