Microsoft’s demonstration this week of microfluidic cooling — tiny liquid channels etched directly into silicon to carry coolant where the heat is generated — represents one of the clearest and most practical moves yet to tackle the runaway thermal problem at the heart of modern AI datacenters...
Microsoft’s lab breakthrough in microfluidic cooling — etching microscopic coolant channels straight into the silicon and using AI to route fluid like leaf veins — promises to remove heat from AI chips up to three times more effectively than today’s best cold-plate systems and, in early tests...
Microsoft’s latest lab demos show microfluidics — routing liquid through microscopic channels etched into silicon — moving from academic curiosity toward practical tooling for the next generation of AI hardware, a test that promises to reduce cooling overhead, enable higher chip density, and...
ai chips
ai datacenters
chip packaging
data center cooling
datacenter energy
direct to silicon
hollow core fiber
microfluidiccooling
semiconductor packaging
thermal management