semiconductor packaging

NM-Tech is reportedly building in-house semiconductor assembly and packaging capability in Zelenograd, a move that would give the Russian chipmaker control over another essential stage between a finished wafer and a deployable component. Frontier India, citing Russian industry reporting and a...

Researchers at POSTECH and KITECH have demonstrated a packaging process that stably stacks more than 10 silicon chips, each approximately 14 micrometers thick, under temperatures below 180°C and pressures below 20 kPa. The reported integration density is approximately four times that of the...

Prime Minister Narendra Modi inaugurated commercial production at CG Semi’s outsourced semiconductor assembly and test facility in Sanand, Gujarat, on July 4, 2026, marking the latest operational plant under the India Semiconductor Mission and adding another packaging-and-testing node to India’s...

Microsoft’s latest lab demos show microfluidics — routing liquid through microscopic channels etched into silicon — moving from academic curiosity toward practical tooling for the next generation of AI hardware, a test that promises to reduce cooling overhead, enable higher chip density, and...