huawei kirin 9030

  1. SMIC N+3 and Huawei Kirin 9030: Metal Pitch, Density, and the Real Gaps vs Intel 18A

    SMIC’s N+3 process in Huawei’s Kirin 9030 reportedly uses a 32.5 nm minimum local metal pitch, narrower than the 36 nm minimum metal pitch found in shipping Intel Panther Lake CPUs on Intel 18A, according to SemiAnalysis’ teardown published in June 2026. That is the kind of comparison that...