semiconductor materials

  1. Samsung, LG and SKC Race to Commercialize Glass Substrates for AI Chip Packaging

    South Korea’s Samsung Electro-Mechanics, LG Innotek and SKC are racing to commercialize glass substrates for AI chip packages, with SKC’s Absolics plant in Georgia positioned as the most aggressive bet while broader industry volume production remains unlikely before 2027 or 2028. The reason this...